wire bond是什么意思_wire bond的中文翻译|音标|读音|用法|短语例句|近反义词

双语例句

1、

In addition, some specimens are annealed at a high temperature for 500 hrs in order to investigate the effect of thermal aging on wire bond reliability.

另外，为了研究热老化对焊点可靠性的影响，一些样品被放置在恒温炉中储存500小时。

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2、

Bond and Life Bond strength and splice zone of welded wire fabric in reinforced concrete slabs

焊接钢筋网在混凝土板中的粘结和搭接长度

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3、

The yield of wire bond mainly depends on the bondability of the bond pad which is affected by the surface charac-teristics.

引线键合的效率主要依赖于受表面特性影响的键合点的可焊性。

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4、

Through the reliability test, the NTC CUP process is suitable for thinner bond wire. So we can reduce the cost of the product which is lower driving current through wafer process change.

通过可靠性试验的研究发现，NTC的CUP工艺，在目前情况下只适用于线径较细的焊接工艺，因而可以对一些驱动电流较低的产品进行芯片工艺改进，降低芯片成本。

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5、

After thermal aging, some effects on wire bond reliability are observed.

500小时的热老化对焊点的可靠性有一定的影响。

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6、

The bond wire, the via hole and the uncontinuity of the microstrip's effect have been taken into account.

分析了变容二极管的等效电路模型，考虑了微带的不连续性、键合引线、通道孔对电路的影响。

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7、

Better manufacturing yield than wire bond for high pin-count chips.

对于高密度引脚芯片,成品率优于丝键合.

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8、

Improving Al clad Steel Wire Bond By Regulating Tool and Die of CONFORM Clad Machine

CONFORM包覆机工模具调整提高铝包钢丝结合力

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9、

Including Bond Wire and Pad effects both, detailed performances have also been proposed with NF deterioration to 3.21/3.23 dB, but S parameters change a little after tuning and optimization, finally, the circuit turns out to have outstanding performances.

完全考虑Bond Wire和Pad效应的性能参数也已经给出，但噪声系数恶化为3.21/3.23dB，S参数在电路调整优化之后变化不大，整体性能比较突出。

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10、

Check the Quality of Package Strictly to Improve the Wire Bond Reliability of SAW Device

加强管壳检验工作，提高SAW器件的键合可靠性

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11、

Faster manufacturing through-put than wire bond for high pin-count chips.

对于高密度引脚芯片,生产效率高于丝键合.

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12、

This paper studied the influence of the different conductor material such as AU| Pd-Au, the different film thickness. 125 ℃. 300 ℃ thermal aging and temperature cycle on bond strength with two methods of destructive wire bond pull test and bond contact resistance test.

本文使用焊点破坏性拉力试验和焊点的接触电阻测试两种方法，研究了导体材料（Au、Pd&Au）、膜层厚度、125℃、300℃热老练和温度循环对焊点键合强度的影响。

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13、

As SAW filters becoming smaller and lighter, the general wire bond has imposed restrictions on its development.

随着SAW器件向小型化、轻型化的发展，传统的引线键合技术已对其形成严重制约。

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相关词组

bond plaster粘结灰泥;
bond area握裹面积;
Bond Analyst债券分析员
anchorage by bond靠粘接锚固;
average bond stress平均粘结应力;
inductive bond阻抗接合
baby bond（美政府发行的）票面为25、50或100美元的债券;小额债券;
inactive bond不活跃债券
gauge of wire电线规格；钢针号数
mortar bond strength灰浆砌合强度
Bond Tradern.证券交易员;
bond strength握裹强度;结合强度;黏结强度;砌合强度;
bail bondn.保释保证书;
bond failure导接线故障;
bond course粘结层;
general mortgage bond一般抵押债券
mortgage bond payable应付抵押债券
bond yield债券投资收益率;债券收益率;债券实际收益率;
generalized valence bond method广义价键法
barbed wiren.<美>带刺铁丝网;刺绳;刺钢丝;刺丝;

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